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30141-23 参数 Datasheet PDF下载

30141-23图片预览
型号: 30141-23
PDF下载: 下载PDF文件 查看货源
内容描述: 的Geode ™ GXM处理器与MMX支持集成的x86解决方案 [Geode⑩ GXm Processor Integrated x86 Solution with MMX Support]
分类和应用: 微控制器和处理器外围集成电路微处理器
文件页数/大小: 244 页 / 4221 K
品牌: NSC [ National Semiconductor ]
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Package Specifications (Continued)  
To choose the proper heatsink, the system designer must  
make sure that the calculated θCA falls above the curve  
(shaded area). The curve itself defines the minimum tem-  
perature rise above ambient that the heatsink can main-  
tain.  
Example 1  
Assume P (max) = 5W and TA (max) = 40°C.  
Therefore:  
T
T  
C
A
See Figure 8-1 as an example of a particular heatsink  
under consideration.  
θ
θ
= ---------------------  
CA  
P
(85 – 40)  
= ----------------------  
5
CA  
θ
CA = 45/5 = 9  
50  
40  
30  
20  
10  
0
θ
= 9  
CA  
In this case, the heatsink under consideration is more than  
adequate since at 5W worst case, it can maintain a 40°C  
case temperature rise above ambient (θCA = 9) when a  
maximum of 45°C (θCA = 8) is required.  
θ
CA = 45/9 = 5  
Example 2  
2
4
6
8
10  
Assume P (max) = 10W and TA (max) = 40°C.  
Heat Dissipated - Watts  
Therefore:  
Figure 8-1. Heatsink Example  
T
T  
C
A
θ
θ
= ---------------------  
CA  
P
(85 – 40)  
= ----------------------  
9
CA  
θ
= 5  
CA  
In this case, the heatsink under consideration is NOT ade-  
quate to maintain the 45°C case temperature rise above  
ambient for a 9W processor.  
For more information on thermal design considerations or  
heatsink properties, refer to the Product Selection Guide of  
any leading vendor of Thermal Engineering solutions.  
Revision 3.1  
197  
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