Note 2: The maximum power dissipation is a function of T
, θ , and T . The maximum allowable power dissipation at any ambient temperature is
JA A
J(max)
P
= (T
–T )/θ . All numbers apply for packages soldered directly into a PC board.
D
J(max) A JA
Note 3: For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
Note 4: Typical Values represent the most likely parametric norm.
Note 5: All limits are guaranteed by testing or statistical analysis.
Note 6: Load and line regulation are measured at constant junction room temperature.
Note 7: The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the
output voltage has dropped 100mV from the nominal value obtained at V = V
+1.5V.
IN
OUT
Note 8: The minimum output current required to maintain regulation.
2
Note 9: Minimum pad size of 0.038in
Note 10: Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22˚C. For information about improved
thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.
Typical Performance Characteristics
Dropout Voltage (VIN-V
)
Short-Circuit Current
OUT
10091922
10091923
Load Regulation
LM1117-ADJ Ripple Rejection
10091943
10091906
7
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