SM9501A/B
PAD LAYOUT (CF9501A)
(Unit: µm)
VDDA
1
VDD
16
(1430,2360)
IN1
IN3
2
3
4
5
6
15
14
PON
OUT
TN
IN2
13
12
VSS
FCN
XO
HLDN
11
10
CP
CB
VSSA
XI
7
DA9501
NPC
8
9
LF
(0,0)
Chip size: 1.43 × 2.36mm
Chip thickness: 300 30ꢀm
PAD size: 100ꢀm (TN: 80ꢀm)
Chip base: V level
SS
PAD NAME and DIMENSIONS (CF9501A)
Pad dimensions [µm]
Number
Name
X
Y
1
VDDA
IN1
386
177
2117
2035
1766
1486
1217
937
2
3
IN3
177
4
IN2
177
5
FCN
XO
177
6
177
7
VSSA
XI
177
586
8
177
288
9
LF
1237
1237
1237
1237
1237
1237
1237
1031
1257
286
10
CB
555
11
CP
809
12
HLDN
VSS
OUT
PON
VDD
1078
1302
1755
2035
2117
1506
13
14
15
16
−
1
TN
1. For test mode
NIPPON PRECISION CIRCUITS INC.—2
NPC [ NIPPON PRECISION CIRCUITS INC ]
