Nexperia
PMV37ENE
60 V, N-channel Trench MOSFET
13. Soldering
3.3
2.9
1.9
solder lands
solder resist
2
3
1.7
solder paste
occupied area
0.6
0.7
(3×)
(3×)
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
Fig. 19. Reflow soldering footprint for SOT23
2.2
1.2
(2×)
1.4
(2×)
solder lands
solder resist
2.6
4.6
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig. 20. Wave soldering footprint for SOT23
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PMV37ENE
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Nexperia B.V. 2021. All rights reserved
Product data sheet
29 November 2021
12 / 15
NEXPERIA [ Nexperia ]
