PBSS305NX
NXP Semiconductors
80 V, 4.6 A NPN low VCEsat (BISS) transistor
11. Soldering
4.75
2.25
2.00
1.90
1.20
solder lands
solder resist
0.85
0.20
1.20
1.20
occupied area
1.70
solder paste
4.60
4.85
Dimensions in mm
0.50
1.20
1.00
(3x)
3
2
1
msa442
0.60 (3x)
0.70 (3x)
3.70
3.95
SOT89 standard mounting conditions for reflow soldering
Fig 16. Reflow soldering footprint
6.60
2.40
3.50
2
solder lands
solder resist
7.60
0.50
1.20
3
1
occupied area
3.00
Dimensions in mm
preferred transport direction during soldering
1.50
0.70
5.30
msa423
Not recommended for wave soldering
Fig 17. Wave soldering footprint
PBSS305NX_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 8 December 2009
11 of 15
NEXPERIA [ Nexperia ]
