NanoAmp Solutions, Inc.
Ball Grid Array Package
N08T1630CxB
0.23±0.05
0.90±0.10
D
A1 BALL PAD
CORNER (3)
1. 0.30±0.05 DIA.
E
2. SEATING PLANE - Z
0.15
Z
0.08
Z
TOP VIEW
SIDE VIEW
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
PARALLEL TO PRIMARY Z.
A1 BALL PAD
CORNER
SD
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
e
SE
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
K TYP
J TYP
e
BOTTOM VIEW
Dimensions (mm)
e = 0.75
BALL
D
E
MATRIX
TYPE
SD
SE
J
K
6±0.10
8±0.10
0.375
0.375
1.125
1.375
FULL
(DOC# 14-02-004 REV H ECN# 01-1102)
The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com.
8
NANOAMP [ NANOAMP SOLUTIONS, INC. ]
