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NFM31HK223R1H3 参数 Datasheet PDF下载

NFM31HK223R1H3图片预览
型号: NFM31HK223R1H3
PDF下载: 下载PDF文件 查看货源
内容描述: [This product specification is applied to Chip EMIFIL]
分类和应用:
文件页数/大小: 11 页 / 542 K
品牌: MURATA [ muRata ]
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AEC-Q200 Murata Standard Specification and Test Methods  
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)  
AEC-Q200 Rev.D issued June 1. 2010  
AEC-Q200  
4
                                                                                                 r
Murata Specification / Deviation  
Meet Table D after testing.  
No. Stress  
Test Method  
3
High Temperature  
Unpowered  
Exposure  
1000 hours @ maximum Operating  
Temperature(Ceramics)  
Measurement at 24+/-2 hours after test  
1000cycles (-55C to +125C)  
Measurement at 24+/-2 hours after test  
1000hours 85C/85%RH.  
4
7
Temperature Cycling  
Biased Humidity  
Meet Table A after testing.  
Meet Table D after testing.  
Note: Ceramics only Specified conditions:  
Rated Voltage and 1.3 to 1.5 volts.  
Add 100Kohm resister.  
Tantalums-Rated Voltage only.  
Measurement at 24+/-2 hours after test  
Condition D Steady State TA=125C  
Full rated ceramic caps  
Measurement at 24+/-2 hours  
after test conclusion.  
8
9
Operational Life  
External Visual  
Meet Table D after testing.  
Visual inspection  
No abnormalities  
No defects  
Not Applicable  
10 Physical Dimension  
12 Resistance to Solvents  
13 Mechanical Shock  
Meet Item 4Type & Dimensions)  
Per MIL-STD-202 Method 215  
Figure 1 of Method 213.  
Meet Table C after testing.  
SMD:Condition F  
Leaded:Condition C  
14 Vibration  
5g's for 20 minutes, 12cycles each of 3  
oritentations  
Meet Table C after testing.  
Use 8"X5" PCB, .031"thick. 7 secure points on  
one long side and 2 secure points at corners of  
opposite sides.  
Parts mounted within 2" from any secure point.  
Test from 10-2000Hz.  
15 Resistance to  
Soldering Heat  
No pre-heat of samples. Note: Test condition D Meet Table A after testing.  
for  
Deviation for AEC-Q200;  
SMD. Test condition B for Leaded. Pre-heat  
condition of 150ºC, 60-120sec is allowed for  
ceramic components.  
Testing condition  
Flux: Ethanol solution of rosin, 25(wt)%  
Pre-heating: 150C+/-10C, 60 to 90s  
Solder: Sn-3.0Ag-0.5Cu  
Solder Temperature: 270C+/-5C  
Immesion Time: 10s+/-1s  
Immesion and emersion rates: 25mm/s  
Then measured after exposure in the room.  
Component Classification:Meet Table E  
95% of the terminations is to be soldered.  
Method B : Not Applicable  
17 ESD  
18 Solderability  
Per AEC-Q200-002  
Per J-STD-002  
Summary to show Min, Max, Mean and  
Deviation for AEC-Q200;  
19 Electrical Characterization Standard deviation at room as well as Min and  
Max operating temperatures.  
Shown in Rated value.  
JEMCPS-02916  
3
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