Caution
!
7. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ• Standard printing pattern of solder paste.
8. Reflow Soldering
1) Soldering paste printing for reflow
• Standard thickness of solder paste: 100µm to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
1.0
2.5
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
4.4
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
(°C)
260°C
245°C±3°C
230°C
220°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
Heating
above 230°C , 60s max.
260°C , 10s
Peak temperature
Cycle of reflow
2 times
2 times
9. Flow Soldering
1) Printing of Adhesive
Adhesive amount shall be about 0.06mg per chip to obtain enough adhesive strength.
The adhesive position is as follows
Adhesive
Position of adhesive
2)Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
°C
(
)
265°C±3°C
250°C
Limit Profile
150
Heating Time
Standard Profile
Time.(s)
60s min.
Standard Profile
Limit Profile
Pre-heating
Heating
150°C, 60s min.
250°C, 4s ~ 6s
2 times
265°C ± 3°C, 5s max.
2 times
Cycle of reflow
JEMCPC-02252A
8
MURATA [ muRata ]
