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GRM2195C1H682JA01D 参数 Datasheet PDF下载

GRM2195C1H682JA01D图片预览
型号: GRM2195C1H682JA01D
PDF下载: 下载PDF文件 查看货源
内容描述: 片状独石陶瓷电容器 [Chip Monolithic Ceramic Capacitors]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 221 页 / 4341 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
!Note  
C02E.pdf  
10.12.20  
sales representatives or product engineers before ordering.  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
GRM Series Specifications and Test Methods (1) (Note 1)-Typical Inspection  
(Note 1) These Specifications and Test Methods indicate typical inspection.  
Please refer to individual specifications (our product specifications or the approval sheet).  
When no "*" is added in PNs table, please refer to GRM Series Specifications and Test Methods (1).  
Continued from the preceding page.  
When "*" is added in PNs table, please refer to GRM Series Specifications and Test Methods (2).  
Specifications  
No.  
Item  
Temperature  
Compensating Type  
Test Method  
High Dielectric Type  
B1, B3: Within ±10%  
(–25 to +85°C)  
R1, R7: Within ±15%  
(–55 to +125°C)  
R6: Within ±15%  
(–55 to +85°C)  
E4: Within +22/–56%  
(+10 to +85°C)  
F1: Within +30/–80%  
(–25 to +85°C)  
F5: Within +22/–82%  
(–30 to +85°C)  
C8: Within ±22%  
(–55 to +105°C)  
The capacitance change should be measured after 5 min. at  
each specified temp. stage.  
(1)Temperature Compensating Type  
The temperature coefficient is determined using the  
capacitance measured in step 3 as a reference.  
When cycling the temperature sequentially from steps 1  
through 5 (5C: +25 to +125°C/C: +20 to +125°C: other temp.  
coeffs.: +25 to +85°C/+20 to +85°C) the capacitance should be  
within the specified tolerance for the temperature coefficient  
and capacitance change as in Table A-1.  
The capacitance drift is calculated by dividing the differences  
between the maximum and minimum measured values in the  
steps 1, 3 and 5 by the cap. value in step 3.  
Within the specified tolerance  
(Table A-1)  
No bias  
Step  
Temperature (°C)  
50% of  
the Rated  
Voltage  
B1: Within +10/–30%  
R1: Within +15/–40%  
F1: Within +30/–95%  
1
Reference Temperature ±2  
–55±3 (for C to 7U/R6/R7/C8)  
–30±3 (for F5), 10±3 (for E4)  
–25±3 (for other TC)  
2
3
4
5
Reference Temperature ±2  
125±3 (for C/R7), 105±3 (for C8)  
85±3 (for other TC)  
Capacitance  
Temperature  
Characteristics  
Reference Temperature ±2  
9
(2) High Dielectric Constant Type  
The ranges of capacitance change compared with the  
Reference Temperature value over the temperature ranges  
shown in the table should be within the specified ranges.*  
When applying voltage, the capacitance change should be  
measured after 1 more min. with applying voltage in  
equilibration of each temp. stage.  
*Initial measurement for high  
dielectric constant type  
Perform a heat treatment at  
150+0/–10°C for one hour  
and then set for 24±2 hours  
at room temperature.  
Within ±0.2% or ±0.05pF  
(whichever is larger.)  
*Do not apply to 1X/25V  
Step  
1
Temperature (°C)  
Applying Voltage (V)  
Capacitance  
Drift  
Reference Temperature ±2  
–55±3 (for C8, R1, R7, R6)  
–25±3 (for B1, B3, F1)  
2
3
4
Perform the initial  
measurement.  
–30±3 (for F5)/10±3 (for E4)  
No bias  
Reference Temperature ±2  
125±3 (for R1, R7)/  
85±3 (for B1, B3, R6  
F1, F5, E4)/105±3 (for C8)  
5
6
7
8
Reference Temperature ±2  
–55±3 (for R1)/  
–25±3 (for B1, F1)  
Reference Temperature ±2  
50% of the rated  
voltage  
125±3 (for R1)/  
85±3 (for B1, F1)  
Solder the capacitor to the test jig (glass epoxy board) shown in  
Fig. 1a using a eutectic solder. Then apply 10N* force in  
parallel with the test jig for 10±1 sec.  
The soldering should be done either with an iron or using the  
reflow method and should be conducted with care so that the  
soldering is uniform and free of defects such as heat shock.  
*1N (GRM02), 2N (GRM03), 5N (GRM15, GRM18)  
No removal of the terminations or other defect should occur.  
c
(in mm)  
Adhesive Strength  
of Termination  
Type  
GRM02  
a
b
c
10  
0.2  
0.3  
0.4  
1.0  
1.2  
2.2  
2.2  
3.5  
4.5  
0.56  
0.9  
1.5  
3.0  
4.0  
5.0  
5.0  
7.0  
8.0  
0.23  
0.3  
0.5  
1.2  
1.65  
2.0  
2.9  
3.7  
5.6  
GRM03  
GRM15  
GRM18  
GRM21  
GRM31  
GRM32  
GRM43  
GRM55  
Solder resist  
Baked electrode or  
copper foil  
Fig. 1a  
Continued on the following page.  
52  
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