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GRM2195C1H682JA01D 参数 Datasheet PDF下载

GRM2195C1H682JA01D图片预览
型号: GRM2195C1H682JA01D
PDF下载: 下载PDF文件 查看货源
内容描述: 片状独石陶瓷电容器 [Chip Monolithic Ceramic Capacitors]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 221 页 / 4341 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
!Note  
C02E.pdf  
10.12.20  
sales representatives or product engineers before ordering.  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
Reference Data  
Continued from the preceding page.  
5. Break Strength  
(1) Test Method  
P
Pressurizing  
speed: 2.5mm/sec.  
Loading Jig End  
Place the chip on a steel plate as illustrated on the right.  
Increase load applied to a point near the center of the  
test sample.  
Storage  
scope  
φ1.0mm  
Amplifier  
Load cell  
(2) Test Samples  
Sample  
Steel plate  
GRM21 5C/R7/F5 Characteristics  
GRM31 5C/R7/F5 Characteristics  
P0.5mm  
(3) Acceptance Criteria  
Define the load that has caused the chip to break or  
crack, as the bending force.  
W
T
γ
5C  
R7  
F5  
Chip Size  
L
W
Charac- Charac- Charac-  
teristics teristics teristics  
(4) Explanation  
Break strength, P, is proportionate to the square of the  
thickness of the ceramic element and is expressed as a  
curve of secondary degree.  
GRM21 1.5 1.2  
GRM31 2.7 1.5  
L
300  
180  
160  
(in mm)  
The formula is:  
2
γ
2 WT  
P=  
(N)  
3L  
W : Width of ceramic element  
T : Thickness of element  
(mm)  
(mm)  
L : Distance between fulcrums (mm)  
γ : Bending stress  
(N/mm2)  
(5) Results  
GRM21  
GRM31  
140  
140  
120  
100  
R7  
5C  
5C  
F5  
120  
100  
80  
R7  
F5  
80  
60  
40  
20  
0
60  
40  
20  
0
0
0.4  
0.8  
1.2  
1.6  
0
0.4  
0.8  
1.2  
1.6  
Thickness of Ceramic Element (mm)  
Thickness of Ceramic Element (mm)  
6. Thermal Shock  
(1) Test method  
Dipping Speed: 25mm/sec.  
After applying flux (an ethanol solution of 25% rosin), dip  
the chip in a solder bath (6Z4 eutectic solder) in  
accordance with the following  
Solder  
Temperature  
Chip Capacitor  
T  
Natural  
Cooling  
conditions:  
Solder Bath  
25D  
(2) Test samples  
2 sec.  
Time  
GRM21 5C/R7/F5 Characteristics T=0.6mm typical  
(3) Acceptance criteria  
Visually inspect the test sample with a 60-power optical  
microscope. Chips exhibiting breaks or cracks should be  
determined to be defective.  
Continued on the following page.  
155