• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Reference Data
Continued from the preceding page.
8. Thermal Shock when Making Corrections with a
Soldering Iron
(1) Test Method
Apply a soldering iron meeting the conditions below to
the soldered joint of a chip that has been soldered to a
paper phenol board, while supplying wire solder. (Note:
the soldering iron tip should not directly touch the ceramic
element of the chip.)
Soldering lron
Wire Solder
Mounting Solder
Duration of
Touching :
Approx. 3 sec.
Paper Phenol Substrate
(2) Test Samples
Soldering Iron
Tip Diameter
ø3mm
GRM21 5C/R7/F5 Characteristics T=0.6mm
Ceramic heater 20W
(3) Acceptance Criteria for Defects
Observe the appearance of the test sample with a
60-power optical microscope. Those units displaying any
breaks or cracks are determined to be defective.
(4) Results
GRM21 5C (T=0.6)
GRM21 R7 (T=0.6)
100
80
60
40
20
0
100
80
60
40
20
0
200
240
280
320
360
200
240
280
320
360
Soldering Iron Tip Temperature (D)
Soldering Iron Tip Temperature (D)
GRM21 F5 (T=0.6)
100
80
60
40
20
0
200
240
280
320
360
Soldering Iron Tip Temperature (D)
157
MURATA [ muRata ]
