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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Reference Data
Continued from the preceding page.
(4) Results
GRM21 5C (T=0.6)
GRM21 R7 (T=0.6)
100
80
60
40
20
0
100
80
60
40
20
0
Fillet up to Chip
Thickness
Fillet up to Chip
Thickness
Larger Fillet
Larger Fillet
0
2
4
6
8
0
2
4
6
8
Flexure (mm)
Flexure (mm)
GRM21 F5 (T=0.6)
100
80
60
40
20
0
Fillet up to Chip
Thickness
Larger Fillet
0
2
4
6
8
Flexure (mm)
3. Temperature Cycling for Solder Fillet Height
(1) Test Method
[Temperature Cycling]
Solder the chips to the substrate of various test fixtures
using sufficient amounts of solder to achieve the required
fillet height. Then subject the fixtures to the cycle
illustrated at right 200 times.
+125D
Room Temperature
Time (min.)
-
55D
5
30
5
30
q Solder Amount
[Solder Amount]
Alumina substrates are typically designed for reflow
soldering.
Glass Epoxy
Substrate
Alumina
or Paper Phenol
Glass epoxy or paper phenol substrates are typically
used for flow soldering.
q
w
w Material
Alumina
(Thickness: 0.64mm)
Glass epoxy (Thickness: 1.64mm)
Paper phenol (Thickness: 1.64mm)
e
Solder to be used
6Z4 Eutectic solder
e Land Dimension
[Land Dimension]
Land Pattern
Ag/Pd=72/28
Alumina
Thickness: 10 to 12µm
Substrate
1.5
1.2
1.5
Glass Epoxy
Substrate
Cu
(in mm)
Thickness: 35µm
Paper Phenol
Substrate
Continued on the following page.
152
MURATA [ muRata ]
