• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice
Notice
Continued from the preceding page.
7. Coating
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
The stress is affected by the amount of resin and curing
contraction.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and the
capacitor may cause the destruction and deterioration of
the capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
An epoxy resin can be used as a less hygroscopic resin.
8. Die Bonding/Wire Bonding (GMA or GMD Series)
1. Die Bonding of Capacitors
2. Wire Bonding
• Use the following materials for the Brazing alloys:
Au-Sn (80/20) 300 to 320 °C in N2 atmosphere
• Mounting
• Wire
Gold wire: 25 micro m (0.001 inch) diameter
• Bonding
(1) Control the temperature of the substrate so it
matches the temperature of the brazing alloy.
(2) Place the brazing alloy on the substrate and place
the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.
(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150 to 200 °C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other
devices with gold wire.
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MURATA [ muRata ]
