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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature," "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces (∆T) as small as possible.
2. After soldering, do not allow the component/PCB to
rapidly cool down.
Table 3
Temperature
of Soldering
Iron Tip
Temperature
Differential
(∆T)
Preheating
Part Number
Atmosphere
Temperature
GRM03/15/18/21/31
GJM03/15
350°C max. 150°C min. ∆TV190°C
280°C max. 150°C min. ∆TV130°C
Air
Air
GQM18/21
GRM32/43/55
GQM22
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
3. The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction in the
adhesive strength of the terminations.
4. Optimum Solder amount when re-working with a
Soldering lron
4-1. For sizes smaller than 0603, (GRM03/15/18,
GJM03/15, GQM18), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component or 0.5mm whichever is smaller. For 0805
and larger sizes, (GRM21/31/32/43/55, GQM21/22),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component. If the solder
amount is excessive, the risk of cracking is higher
during board bending or under any other stressful
condition.
Solder Amount
in section
4-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
4-3. Solder wire with ø0.5mm or smaller is required for
soldering.
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
Continued on the following page.
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MURATA [ muRata ]
