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• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the component's surface (∆T) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of Tin is used. Please confirm the Solderability of Tin
plated termination chips before use.
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature (D)
Soldering
Peak Temperature
Gradual
Cooling
200°C
∆T
170°C
150°C
130°C
Preheating
Time
60-120 seconds 30-60 seconds
Vapor Reflow
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (∆T)
between the component and the solvent within the range
shown in the table 1.
Temperature (D)
Soldering
Peak Temperature
Gradual
Cooling
∆T
170°C
150°C
130°C
Table 1
Part Number
GRM02/03/15/18/21/31
GJM03/15
Temperature Differential
Preheating
∆TV190°C
LLL15/18/21/31
LLR18
Time
20 seconds max.
60-120 seconds
GQM18/21
GRM32/43/55
LLA18/21/31
LLM21/31
[Allowable Reflow Soldering Temperature and Time]
280
270
260
250
240
∆TV130°C
GNM
GQM22
Recommended Conditions
230
220
Pb-Sn Solder
Lead Free Solder
0
30
60
90
120
Infrared Reflow Vapor Reflow
Soldering Time (sec.)
Peak Temperature 230 to 250°C 230 to 240°C
240 to 260°C
In a case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
0.2mm min.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
GRM02/03: 1/3 of Chip Thickness min.
in section
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm* min.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Continued on the following page.
138
MURATA [ muRata ]
