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!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
!Caution
Continued from the preceding page.
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
[Standard Conditions for Flow Soldering]
Temperature (D)
Soldering
Soldering
Peak
Gradual
Cooling
Temperature
∆T
Preheating
Peak
Temperature
Preheating conditions are shown in table 2. It is required
to keep the temperature differential between the solder
and the component's surface (∆T) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
Preheating
Time
30-90 seconds
5 seconds max.
[Allowable Flow Soldering Temperature and Time]
280
270
3. When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the range
shown in the table 2.
260
250
240
230
220
4. Do not apply flow soldering to chips not listed in table 2.
0
10
20
30
40
Soldering Time (sec.)
Table 2
Part Number
GRM18/21/31
LLL21/31
Temperature Differential
In a case of repeated soldering, the accumulated
soldering time must be within the range shown above.
∆TV150°C
GQM18/21
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
100 to 120°C
250 to 260°C
N2
Preheating Peak Temperature
Soldering Peak Temperature
Atmosphere
90 to 110°C
240 to 250°C
Air
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Up to Chip Thickness
Adhesive
in section
Continued on the following page.
139
MURATA [ muRata ]
