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GRM1882C2A270JA01 参数 Datasheet PDF下载

GRM1882C2A270JA01图片预览
型号: GRM1882C2A270JA01
PDF下载: 下载PDF文件 查看货源
内容描述: [Chip Multilayer Ceramic Capacitors for General Purpose]
分类和应用:
文件页数/大小: 220 页 / 3429 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
!Note  
C02E.pdf  
sales representatives or product engineers before ordering.  
09.9.18  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
!Caution  
Continued from the preceding page.  
6. Electrical Test on Printed Circuit Board  
1. Confirm position of the support pin or specific jig, when  
inspecting the electrical performance of a capacitor after  
mounting on the printed circuit board.  
[Not Recommended]  
Peeling  
1-1. Avoid bending printed circuit board by the pressure  
of a test pin, etc.  
Test-pin  
The thrusting force of the test probe can flex the PCB,  
resulting in cracked chips or open solder joints.  
Provide support pins on the back side of the PCB to  
prevent warping or flexing.  
[Recommended]  
Support Pin  
1-2. Avoid vibration of the board by shock when a test pin  
contacts a printed circuit board.  
Test-pin  
7. Printed Circuit Board Cropping  
1. After mounting a capacitor on a printed circuit board, do  
not apply any stress to the capacitor that is caused by  
bending or twisting the board.  
8
[Bending]  
[Twisting]  
1-1. In cropping the board, the stress as shown right may  
cause the capacitor to crack.  
Try not to apply this type of stress to a capacitor.  
2. Check of the cropping method for the printed circuit  
board in advance.  
2-1. Printed circuit board cropping shall be carried out by  
using a jig or an apparatus to prevent the mechanical  
stress which can occur to the board.  
(1) Example of a suitable jig  
Recommended example: the board should be  
pushed as close to the near the cropping jig as  
possible and from the back side of board in order  
to minimize the compressive stress applied to  
capacitor.  
[Outline of Jig]  
Printed Circuit Board  
V-groove  
Not recommended example* when the board is  
pushed at a point far from the cropping jig and  
from the front side of board as below, the  
capacitor may form a crack caused by the tensile  
stress applied to capacitor.  
Boad Cropping Jig  
Recommended  
Not recommended  
Direction of Load  
Direction of Load  
Load Point  
Printed Circuit Board  
Components  
Components  
Load Point  
Printed Circuit Board  
Continued on the following page.  
149  
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