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ERB32Q5C1H821JDX1L 参数 Datasheet PDF下载

ERB32Q5C1H821JDX1L图片预览
型号: ERB32Q5C1H821JDX1L
PDF下载: 下载PDF文件 查看货源
内容描述: 应用规格IFI C电容高频陶瓷电容 [Application Spec ifi c Capacitors High Frequency Ceramic Capacitors]
分类和应用:
文件页数/大小: 20 页 / 3054 K
品牌: MURATA [ muRata ]
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A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S  
High Frequency Ceramic Capacitors  
ERB Soldering and Mounting  
5. Flow Soldering  
When sudden heat is applied to the components, the  
mechanical strength of the components should go down  
because remarkable temperature change causes  
deformity inside components. And an excessively long  
soldering time or high soldering temperature results in  
leaching of the outer electrodes, causing poor adhesion  
or a reduction in capacitance value due to loss of contact  
between electrodes and end termination.  
Standard Conditions for Flow Soldering  
Temperature (%)  
Soldering  
Peak Temperature  
Gradual  
Cooling  
$T  
170oC  
150oC  
130oC  
Preheating  
In order to prevent mechanical damage in the  
components, preheating shoud be required for the both  
components and the PCB board. Preheating conditions  
are shown inTable 2. It is required to keep temperature  
differential between the soldering and the components  
surface ($T) as small as possible.  
When components are immersed in solvent after  
mounting, be sure to maintain the temperature difference  
between the component and solvent within the range  
shown in Table 2.  
Time  
5 seconds max.  
60-120 seconds  
Allowable Soldering Temperature and Time  
280  
270  
260  
250  
240  
Do not apply flow soldering to chips not listed in Table 2.  
230  
220  
Table 2  
0
10  
20  
30  
40  
Soldering Time (sec.)  
Part Number  
Temperature Differential  
In case of repeated soldering, the accumulated  
soldering time must be within the range shown above.  
$T-150%  
ERB18/21  
Recommended Conditions  
Pb-Sn Solder  
240-250oC  
Air  
Lead Free Solder  
250-260oC  
N2  
Peak Temperature  
Atmosphere  
Pb-Sn Solder: Sn-37Pb  
Lead Free Solder: Sn-3.0Ag-0.5Cu  
Optimum Solder Amount for Flow Soldering  
The top of the solder fillet should be lower than the  
thickness of components. If the solder amount is  
excessively big, the risk of cracking is higher during  
board bending or under any other stressful conditions.  
Up to Chip Thickness  
Adhesive  
Continued on the following page.  
60 – Innovator in Electronics  
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