A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S
High Frequency Ceramic Capacitors
ERB Soldering and Mounting
3. Reflow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
Standard Conditions for Reflow Soldering
Infrared Reflow
because remarkable temperature change causes
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in Table 1. It is required to
keep temperature differential between the soldering and
the components surface ($T) as small as possible.
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile where
peak solder temperature is below the Tin melting point is
used. Please confirm the solderability of Tin plating
termination chip before use.
Temperature (%)
Peak Temperature
200oC
Soldering
Gradual
Cooling
$T
170oC
150oC
130oC
Preheating
Time
60-120 seconds 30-60 seconds
Vapor Reflow
When components are immersed in solvent after mounting,
be sure to maintain the temperature difference ($T)
between the component and solvent within the range
shown in theTable 1.
Temperature (%)
Soldering
Peak Temperature
Gradual
Cooling
$T
170oC
150oC
130oC
Table 1
Part Number
GRM02/03/15/18/21/31
GJM03/15
Temperature Differential
Preheating
ERB18/21
LLL15/18/21/31
$T-190%
Time
20 seconds max.
60-120 seconds
ERB18/21
GQM18/21
GRM32/43/55
LLA18/21/31
LLME2R1/B3312
GNM
Allowable Soldering Temperature and Time
280
270
260
250
240
$T-130%
ERB32
Recommended Conditions
230
220
Pb-Sn Solder
Infrared Reflow Vapor Reflow
Lead Free Solder
0
30
60
90
120
Soldering Time (sec.)
Peak Temperature
Atmosphere
230-250oC
230-240oC
240-260oC
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive fillet height solder.
Optimum Solder Amount for Reflow Soldering
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
cracked chips.
0.2mm min.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued on the following page.
Innovator in Electronics – 59
C-29-C
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MURATA [ muRata ]
