A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S
High Frequency Ceramic Capacitors
ERB Soldering and Mounting
■ !Caution (Soldering and Mounting)
1. Mounting Position
Choose a mounting position that minimizes the stress
Component Direction
imposed on the chip during flexing or bending of the
Locate chip
horizontal to the
direction in
which stress
acts
board.
Chip Mounting Close to Board Separation Point
C
Chip arrangement
Worst A-C-(B~D) Best
Perforation
B
D
A
Slit
2. Chip Placing
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
Incorrect
Correct
Suction Nozzle
Deflection
Board
Board Guide
Support Pin
Continued on the following page.
58 – Innovator in Electronics
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MURATA [ muRata ]
