Freescale Semiconductor, Inc.
Quality and Reliability — Overview
A Major Objective of the Production Cycle
From rigid incoming inspection of piece parts and materials,
to stringent outgoing quality verification, the Motorola
assembly and process flow is encompassed by an elaborate
system of test and inspection stations; stations to ensure a
step-by-step adherence to prescribed procedure. This
produces the high level of quality for which Motorola is
known . . . from start to finish.
quality inspection to insure product conformance to
specification. In addition, Statistical Process Control (S.P.C.)
techniques are utilized on all critical processes to insure
processing equipment is capable of producing the product to
the target specification while minimizing the variability.
Quality control in wafer processing, assembly, and final test
impart Motorola sensor products with a level of reliability that
easily exceeds almost all industrial, consumer, and military
requirements.
As illustrated in the process flow overview, every major
manufacturing step is followed by an appropriate in-process
Compensated Sensor Flow Chart
BINNING
CHECK
INITIAL
OXIDATION
P+ PHOTO
RESIST
P+
LASER I.D.
DIFFUSION
1
2
3
4
9
RESISTOR
PHOTO
RESIST
EMITTER
PHOTO
RESIST
EMITTER
DIFFUSION
FINAL
OXIDATION
RESISTOR
IMPLANT
6
10
14
7
8
5
CONTACT
PHOTO
RESIST
METAL
PHOTO
RESIST
THIN-FILM
METAL DEP.
THIN-FILM
METAL P.R.
FRONT
METAL
11
CAVITY
PHOTO
RESIST
WAFER
FINAL
VISUAL
WAFER
TO WAFER
BOND
CLASS
PROBE
CAVITY
ETCH
15
18
16
12
13
SAW AND
WASH
DIE SORT
AND LOAD
CELL
MARKING
DIE BOND
AND CURE
WIREBOND
17
19
23
100%
FUNCTIONAL
TEST
LASER
TRIM
GEL FILL
AND CURE
FINAL
VISUAL
PACK AND
SHIP
20
21
22
1–2
www.motorola.com/semiconductors
Motorola Sensor Device Data
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA [ MOTOROLA ]
