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MMA1250D 参数 Datasheet PDF下载

MMA1250D图片预览
型号: MMA1250D
PDF下载: 下载PDF文件 查看货源
内容描述: 传感器 [Sensor]
分类和应用: 传感器
文件页数/大小: 670 页 / 6314 K
品牌: MOTOROLA [ MOTOROLA ]
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Freescale Semiconductor, Inc.  
Mechanical Failures  
PRESSURE SENSOR SOLUTIONS  
The range of solutions for pressure sensors to media  
compatibility is very diverse. Mechanical pressure sensors still  
occupy a number of applications due to this media compatibility  
concern. These devices typically operate on a variable  
inductance method and are typically not as linear as a  
piezoresistive element. Figure 10 shows a comparison  
between a mechanical pressure sensor and a piezoresistive  
element for a washing machine level sensing application. The  
graph shows a nonlinear response for the mechanical sensor  
and a corresponding straight line for the piezoresistive element.  
A common method of obtaining media compatibility is to  
place a barrier coating over the die and wire interconnection.  
This organic encapsulant provides a physical barrier between  
the harsh environment and the circuitry. The barrier coating  
can range from silicone to parylene or other dense films that  
are typically applied as a very thin layer. This technique offers  
limited protection to some environments due to swelling  
and/or dissolution of the encapsulant material when in contact  
with media with a similar solubility. When a polymeric material  
has a solubility parameter of the same value as the  
corresponding media, swelling or dissolution will occur.  
Stainless steel diaphragms backfilled with silicone oil  
provide a rugged barrier to most media environments, but  
generally are very costly and limit the sensitivity of the device.  
The silicone oil is used to transmit the stress from the  
diaphragm to the piezoresistive element. If a polymeric  
material is used as the die attach, the silicone oil will permeate  
out of the package. This concern requires a die attach that is  
typically of higher modulus than a silicone and may not  
adequately isolate the package stress from the die.  
The occurrence of mechanical failures include components  
of fatigue, environment assisted cracking, and creep.  
Packaging materials, process, and residual stresses are all  
contributors to mechanical failure. A summary of acceleration  
stresses is shown in Table 3. Contact with harsh media is an  
accelerating stress for all of the mechanical failure mechanisms.  
Table 3. Mechanical Failure Mechanisms  
Failure Mechanism  
Acceleration Stresses  
Fatigue crack initiation  
Mechanical stress/strain range  
Cyclic temperature range  
Frequency  
Media  
Fatigue crack propagation  
Mechanical stress range  
Cyclic temperature range  
Frequency  
Media  
Environment assisted cracking Mechanical stress  
Temperature  
Media  
Creep  
Mechanical stress  
Temperature  
Media  
175  
170  
165  
160  
2
1.8  
1.6  
1.4  
1.2  
1
155  
150  
0.8  
0.6  
0.4  
0.2  
0
145  
140  
0
1
2
3
4
5
6
TIME (MINUTES)  
WASHING  
MACHINE  
SENSOR  
PIEZORESISTIVE  
PRESSURE  
SENSOR  
Figure 10. Graphical comparison of the output from a mechanical pressure sensor compared to a piezoresistive  
sensor during a washing machine fill cycle.  
1–24  
www.motorola.com/semiconductors  
Motorola Sensor Device Data  
For More Information On This Product,  
Go to: www.freescale.com  
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