Freescale Semiconductor, Inc.
Markings and Case Diagrams
15.2 Packaging Instructions
Tape and reel packaging per 12MRH00360A with the following conditions applicable for Dual In-Line
SOP (SOIC) package.
Component Orientation: Arrange parts with the pin 1
side closest to the tape's round sprocket holes on the
tape's trailing edge.
15.3 Marking Instructions
In accordance with 12MRH00191A internal specification applied for Dual in-line SO package.
Bar marked part way accross Pin 1 end of package.
Bar width 10 to 20 mils, length to be at least four
times Bar width. Bar placement may extend across
MC44BC375x
chamfer and dimple areas.
Pin 1 Dot or Dimple
•
•
1st line:
MC44BC375U for MC44BC375UD device
MC44BC375J for MC44BC375JD device
MC44BC375T for MC44BC375TD device
(Part number coded on 10 digits)
2nd line:
Assembly site code AW (2 digits) followed by the
wafer lot code L (1 digit),
year Y (1 digit) and
work week WW (2 digits)
MOTOROLA
MC44BC375/U/J/T Technical Data
For More Information On This Product,
Go to: www.freescale.com
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MOTOROLA [ MOTOROLA ]
