OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
1
9
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
7
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.280
0.200
0.020
0.065
MIN
19.05
6.23
3.94
0.39
1.40
MAX
19.94
7.11
5.08
0.50
1.65
0.750
0.245
0.155
0.015
0.055
–T–
SEATING
PLANE
K
F
G
J
K
0.100 BSC
2.54 BSC
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
G
N
M
D 14 PL
0.25 (0.010)
J 14 PL
0.25 (0.010)
L
M
N
0.300 BSC
7.62 BSC
0
15
0
15
M
S
T
A
M
S
T
B
0.020
0.040
0.51
1.01
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
ISSUE L
14
8
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
1
7
4. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
L
C
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
0
10
0
10
0.015
0.039
0.39
1.01
H
G
D
M
MOTOROLA CMOS LOGIC DATA
MC14001UB
23
MOTOROLA [ MOTOROLA ]
