512Mb : 32 Me g x 16, 16 Me g x 32 Mo b ile SDRAM
Ba ll De scrip t io n s
Ta b le 3:
54-Ba ll VFBGA 90-Ba ll VFBGA
A8, B9, B8, C9, R8, N7, R9, N8, DQ0–DQ31
VFBGA Ba ll De scrip t io n s (Co n t in u e d )
Sym b o l
Typ e
De scrip t io n
Data input/output: Data bus.
I/O
C8, D9, D8, E9, P9, M8, M7, L8,
E1, D2, D1, C2, L2, M3, M2, P1,
C1, B2, B1, A2
N2, R1, N3, R2,
E8, D7, D8, B9,
C8, A9, C7, A8,
A2, C3, A1, C2,
B1, D2, D3, E2
A7, B3, C7, D3
A3, B7, C3, D7
B2, B7, C9, D9,
E1, L1, M9, N9,
P2, P7
VDDQ
VssQ
Supply
Supply
DQ power: Provide isolated power to DQ for improved noise
immunity.
B8, B3, C1, D1,
E9, L9, M1, N1,
P3, P8
DQ ground: Provide isolated ground to DQ for improved noise
immunity.
A9, E7, J9
A1, E3, J1
–
A7, F9, L7, R7
A3, F1, L3, R3
E3, E7, K3
VDD
VSS
NC
Supply
Supply
–
Core power supply.
Ground.
Internally not connected: These balls could be left unconnected,
but it is recommended they be connected to Vss.
E2
–
–
VSSQ
DNU
–
–
This TEST pin must be tied to VSS or VSSQ in normal operation.
K2
Should not be used in the application. However, it may be
connected to Vss (ground).
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. H 6/07 EN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
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