256MB / 512MB (x64)
168-PIN SDRAM DIMMs
Ta b le 12: IDD Sp e cifica t io n s a n d Co n d it io n s – 256MB Mo d u le
Notes: 1, 5, 6, 11, 13; notes appear on page 17; VDD, VDDQ = +3.3v ±0.3v; SDRAM component values only
MAX
PARAMETER/CONDITION
SYMBOL -13E -133 -10E UNITS
NOTES
OPERATING CURRENT: Active Mode; Burst = 2; READ or WRITE;
IDD1
1,080 1,080 1,080
mA
3, 18,19, 22
t
tRC = RC (MIN)
IDD2
IDD3
16
16
16
mA
mA
22
STANDBY CURRENT: Power-Down Mode; All device device
banks idle; CKE = LOW
320
320
320
3, 12, 19, 22
STANDBY CURRENT: Active Mode;CKE = HIGH; CS# = HIGH; All
t
device banks active after RCD met; No accesses in progress
OPERATING CURRENT: Burst Mode; Continuous burst; READ or
WRITE; All device banks active
IDD4
1,080 1,080 1,080
2,280 2,160 2,160
mA
3, 18, 19, 22
t
tRFC = RFC (MIN)
IDD5
IDD6
IDD7
mA
mA
mA
3, 12
18, 19, 22, 31
4
AUTO REFRESH CURRENT
tRFC = 7.8125µs
28
20
28
20
28
20
CKE = HIGH; CS# = HIGH
SELF REFRESH CURRENT: CKE ? 0.2V
Ta b le 13: IDD Sp e cifica t io n s a n d Co n d it io n s – 512MB Mo d u le
Notes: 1, 6, 11, 13; notes appear on page 17; VDD, VDDQ = +3.3V ±0.3V; SDRAM component values only
MAX
PARAMETER/CONDITION
SYMBOL -13E -133 -10E UNITS
NOTES
a
OPERATING CURRENT: Active Mode; Burst = 2; READ or WRITE;
1,096 1,016 1,016
mA
3, 18,19, 22
IDD1
t
tRC = RC (MIN)
b
a
32
32
32
mA
mA
22
STANDBY CURRENT: Power-Down Mode; All device device
banks idle; CKE = LOW
IDD2
IDD3
336
336
336
3, 12, 19, 22
STANDBY CURRENT: Active Mode; CKE = HIGH; CS# = HIGH; All
t
device banks active after RCD met; No accesses in progress
a
OPERATING CURRENT: Burst Mode; Continuous burst; READ or
WRITE; All device banks active
1,096 1,096 1,096
4,560 4,320 4,320
mA
3, 18, 19, 22
IDD4
b
b
b
t
tRFC = RFC (MIN)
mA
mA
mA
3, 12
18, 19, 22, 31
4
AUTO REFRESH CURRENT
IDD5
IDD6
IDD7
tRFC = 7.8125µs
56
40
56
40
56
40
CKE = HIGH; CS# = HIGH
SELF REFRESH CURRENT: CKE ?ꢀ0.2V
NOTE:
a - Value calculated as one module bank in this condition, and all other module banks in Power-Down Mode (IDD2).
b - Value calculated reflects all module banks in this condition.
32,64 Meg x 64 SDRAM DIMMs
SD8_16C32_64x64AG_C.fm - Rev. C 11/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology Inc.
13
MICRON [ MICRON TECHNOLOGY ]
