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M25P32-VMW3TGB 参数 Datasheet PDF下载

M25P32-VMW3TGB图片预览
型号: M25P32-VMW3TGB
PDF下载: 下载PDF文件 查看货源
内容描述: [Micron M25P32 Serial Flash Embedded Memory]
分类和应用:
文件页数/大小: 50 页 / 658 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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Micron M25P32 Serial Flash Embedded Memory  
SPI Modes  
Figure 5: Bus Master and Memory Devices on the SPI Bus  
V
SS  
V
CC  
R
SDO  
SDI  
SPI interface with  
(CPOL, CPHA) =  
(0, 0) or (1, 1)  
SCK  
C
V
V
V
CC  
C
C
CC  
CC  
V
V
V
SS  
SS  
SS  
SPI Bus Master  
DQ1 DQ0  
DQ1 DQ0  
DQ1 DQ0  
SPI memory  
device  
SPI memory  
device  
SPI memory  
device  
R
R
R
CS3  
CS2  
CS1  
W#  
HOLD#  
S#  
S#  
W# HOLD#  
S#  
W#  
HOLD#  
1. WRITE PROTECT (W#) and HOLD# should be driven HIGH or LOW as appropriate.  
Notes:  
2. Resistors (R) ensure that the memory device is not selected if the bus master leaves the  
S# line HIGH-Z.  
3. The bus master may enter a state where all I/O are HIGH-Z at the same time; for exam-  
ple, when the bus master is reset. Therefore, the C must be connected to an external  
pull-down resistor so that when all I/O are HIGH-Z, S# is pulled HIGH while C is pulled  
LOW. This ensures that S# and C do not go HIGH at the same time and that the tSHCH  
requirement is met.  
4. The typical value of R is 100 kΩ, assuming that the time constant R × Cp (Cp = parasitic  
capacitance of the bus line) is shorter than the time during which the bus master leaves  
the SPI bus HIGH-Z.  
5. Example: Given that Cp = 50 pF (R × Cp = 5μs), the application must ensure that the bus  
master never leaves the SPI bus HIGH-Z for a time period shorter than 5μs.  
PDF: 09005aef84566541  
m25p32.pdf - Rev. M 9/11 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
10  
© 2011 Micron Technology, Inc. All rights reserved.