Numonyx® Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC)
3.0
Package Information
3.1
56-Lead TSOP Package for 32-, 64-, 128-Mbit
Figure 3: 56-Lead TSOP Package Mechanical
Z
A
2
See Note 2
See Notes 1 and 3
Pin 1
e
See Detail B
E
Y
D
1
A
1
D
Seating
Plane
See Detail A
A
Detail A
Detail B
C
0
b
L
Notes:
1.
2.
3.
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Table 1:
56-Lead TSOP Dimension Table
Millimeters
Nom
Inches
Nom
Parameter
Symbol
Min
Max
Min
Max
Package Height
Standoff
A
A1
A2
b
—
—
1.200
—
—
—
0.047
—
0.050
0.965
0.170
0.100
18.200
13.800
—
—
0.002
0.038
0.0067
0.004
0.717
0.543
—
—
Package Body Thickness
Lead Width1
0.995
0.220
0.150
18.400
14.000
0.500
20.00
0.600
1.025
0.270
0.200
18.600
14.200
—
0.039
0.0087
0.006
0.724
0.551
0.0197
0.787
0.024
0.040
0.0106
0.008
0.732
0.559
—
Lead Thickness
Package Body Length
Package Body Width
Lead Pitch
c
D1
E
e
Terminal Dimension
Lead Tip Length
D
L
19.800
0.500
20.200
0.700
0.780
0.020
0.795
0.028
Jan 2011
208032-03
Datasheet
13
MICRON [ MICRON TECHNOLOGY ]
