PIC18F2450/4450
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
E
EXPOSED
K
p
METAL PAD
(NOTE 2)
D
D2
2
1
B
n
PIN 1
INDEX ON
E2
OPTIONAL
EXPOSED PAD
INDEX AREA
L
(PROFILE MAY VARY)
(
NOTE 1)
TOP VIEW
BOTTOM VIEW
DETAIL: CONTACT VARIANTS
A
A3
A1
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Contacts
Pitch
44
44
.026 BSC
.035
.001
.010 REF
0.65 BSC
Overall Height
Standoff
A
A1
A3
E
.031
.039
0.80
0.90
0.02
1.00
.000
.002
0
0.05
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
0.25 REF
.309
.236
.309
.236
.008
.014
.014
.315
.258
.315
.258
.013
.016
.321
.260
.321
.260
.013
.019
-
7.85
8.00
6.55
8.00
6.55
0.33
0.40
8.15
6.60
8.15
6.60
0.35
0.48
E2
D
5.99
7.85
5.99
0.20
0.35
0.20
D2
B
§
L
Contact-to-Exposed-Pad
§
K
-
-
-
*
Controlling Parameter
§
Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: M0-220
Drawing No. C04-103
Revised 09-12-05
DS39760A-page 302
Advance Information
© 2006 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
