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PIC18F2450-I/SO 参数 Datasheet PDF下载

PIC18F2450-I/SO图片预览
型号: PIC18F2450-I/SO
PDF下载: 下载PDF文件 查看货源
内容描述: 28 /40/ 44引脚,高性能, 12 MIPS ,增强型闪存, USB微控制器采用纳瓦技术 [28/40/44-Pin, High-Performance, 12 MIPS, Enhanced Flash, USB Microcontrollers with nanoWatt Technology]
分类和应用: 闪存微控制器和处理器外围集成电路光电二极管PC时钟
文件页数/大小: 320 页 / 5591 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC18F2450/4450  
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)  
E1  
D
2
α
n
1
E
A2  
A
L
c
B1  
B
β
A1  
p
eB  
Units  
Dimension Limits  
INCHES*  
NOM  
40  
MILLIMETERS  
MIN  
MAX  
MIN  
NOM  
40  
MAX  
n
p
Number of Pins  
Pitch  
.100  
2.54  
Top to Seating Plane  
A
.160  
.175  
.190  
.160  
4.06  
3.56  
4.45  
3.81  
4.83  
4.06  
Molded Package Thickness  
Base to Seating Plane  
Shoulder to Shoulder Width  
Molded Package Width  
Overall Length  
A2  
A1  
E
.140  
.015  
.595  
.530  
2.045  
.120  
.008  
.030  
.014  
.620  
5
.150  
0.38  
15.11  
13.46  
51.94  
3.05  
0.20  
0.76  
0.36  
15.75  
5
.600  
.545  
2.058  
.130  
.012  
.050  
.018  
.650  
10  
.625  
.560  
2.065  
.135  
.015  
.070  
.022  
.680  
15  
15.24  
13.84  
52.26  
3.30  
0.29  
1.27  
0.46  
16.51  
10  
15.88  
14.22  
52.45  
3.43  
0.38  
1.78  
0.56  
17.27  
15  
E1  
D
Tip to Seating Plane  
Lead Thickness  
L
c
Upper Lead Width  
B1  
B
eB  
α
Lower Lead Width  
Overall Row Spacing  
§
Mold Draft Angle Top  
Mold Draft Angle Bottom  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
β
5
10  
15  
5
10  
15  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.  
JEDEC Equivalent: MO-011  
Drawing No. C04-016  
DS39760A-page 300  
Advance Information  
© 2006 Microchip Technology Inc.