PIC18F2450/4450
44-Lead Plastic Thin-Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45°
α
A
c
φ
β
A1
A2
L
F
Units
Dimension Limits
INCHES
NOM
44
MILLIMETERS
*
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
44
.031
11
0.80
11
Pins per Side
n1
A
Overall Height
.039
.043
.039
.004
.024
.039 REF.
3.5
.047
1.00
1.10
1.20
Molded Package Thickness
Standoff
A2
A1
L
.037
.002
.018
.041
.006
.030
0.95
0.05
0.45
1.00
0.10
0.60
1.05
0.15
0.75
Foot Length
Footprint (Reference)
Foot Angle
F
φ
1.00 REF.
3.5
12.00
0
7
0
7
Overall Width
E
D
.463
.463
.390
.390
.004
.012
.025
.472
.472
.394
.394
.006
.015
.035
10
.482
.482
.398
.398
.008
.017
.045
11.75
11.75
9.90
9.90
0.09
0.30
0.64
12.25
12.25
10.10
10.10
0.20
Overall Length
12.00
10.00
10.00
0.15
0.38
0.89
10
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
E1
D1
c
B
CH
α
0.44
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
1.14
5
15
15
5
15
15
β
5
10
5
10
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Revised 07-22-05
Drawing No. C04-076
© 2006 Microchip Technology Inc.
Advance Information
DS39760A-page 301
MICROCHIP [ MICROCHIP ]
