PIC17C4X
21.6
Package Marking Information
40-Lead PDIP/CERDIP
Example
PIC17C43-25I/P
L006
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
AABBCDE
9441CCA
40 Lead CERDIP Windowed
Example
XXXXXXXXXXX
PIC17C44
XXXXXXXXXXX
XXXXXXXXXXX
/JW
L184
AABBCDE
9444CCT
44-Lead PLCC
Example
XXXXXXXXXX
PIC17C42
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
-16I/L
L013
9445CCN
44-Lead MQFP
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
PIC17C44
-25/PT
L247
AABBCDE
9450CAT
44-Lead TQFP
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
PIC17C44
-25/TQ
L247
AABBCDE
9450CAT
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
BB
C
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.,
S = Tempe, Arizona, U.S.A.
D
E
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales
Office. For QTP devices, any special marking adders are included in QTP
price.
DS30412C-page 210
1996 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
