PIC16F913/914/916/917/946
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED
PAD
e
E
b
E2
2
1
2
1
K
N
N
NOTE 1
L
BOTTOM VIEW
TOP VIEW
A
A3
A1
Units
MILLIMETERS
NOM
Dimension Limits
MIN
MAX
Number of Pins
N
e
28
Pitch
0.65 BSC
0.90
Overall Height
Standoff
A
0.80
0.00
1.00
0.05
A1
A3
E
0.02
Contact Thickness
Overall Width
0.20 REF
6.00 BSC
3.70
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
E2
D
3.65
4.20
6.00 BSC
3.70
D2
b
3.65
0.23
0.50
0.20
4.20
0.35
0.70
–
0.30
L
0.55
K
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-105B
© 2007 Microchip Technology Inc.
DS41250F-page 309
MICROCHIP [ MICROCHIP ]
