PIC16F913/914/916/917/946
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
1
2
b
NOTE 1
e
c
A2
A
φ
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
28
0.65 BSC
Overall Height
Molded Package Thickness
Standoff
A
–
–
1.75
–
2.00
1.85
–
A2
A1
E
1.65
0.05
7.40
5.00
9.90
0.55
Overall Width
Molded Package Width
Overall Length
Foot Length
7.80
5.30
10.20
0.75
1.25 REF
–
8.20
5.60
10.50
0.95
E1
D
L
Footprint
L1
c
Lead Thickness
Foot Angle
0.09
0°
0.25
8°
φ
4°
Lead Width
b
0.22
–
0.38
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-073B
DS41250F-page 312
© 2007 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
