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PIC16F87-I/P 参数 Datasheet PDF下载

PIC16F87-I/P图片预览
型号: PIC16F87-I/P
PDF下载: 下载PDF文件 查看货源
内容描述: 18 /20/ 28引脚增强型闪存微控制器采用纳瓦技术 [18/20/28-Pin Enhanced FLASH Microcontrollers with nanoWatt Technology]
分类和应用: 闪存微控制器
文件页数/大小: 214 页 / 3543 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC16F87/88  
18.2 DC Characteristics: Power-down and Supply Current  
PIC16F87/88 (Industrial)  
PIC16LF87/88 (Industrial) (Continued)  
PIC16LF87/88  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
(Industrial)  
PIC16F87/88  
Standard Operating Conditions (unless otherwise stated)  
(Industrial)  
Operating temperature  
-40°C TA +85°C for industrial  
Param  
No.  
Device  
Supply Current (IDD)  
Typ Max Units  
Conditions  
(2,3)  
All devices 1.8  
2.3  
2.2  
2.2  
4.2  
4.0  
4.0  
mA  
mA  
mA  
mA  
mA  
mA  
-40°C  
1.6  
25°C  
85°C  
-40°C  
25°C  
85°C  
VDD = 4.0V  
VDD = 5.0V  
1.3  
FOSC = 20 MHZ  
(HS Oscillator)  
All devices 3.0  
2.5  
2.5  
Legend:  
Shading of rows is to assist in readability of the table.  
Note 1: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with  
the part in SLEEP mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta  
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).  
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading  
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on  
the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated  
by the formula Ir = VDD/2REXT (mA) with REXT in k.  
DS30487B-page 168  
Preliminary  
2003 Microchip Technology Inc.  
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