PIC16F688
14.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +125°C
Param
Sym
No.
Characteristic
Typ
Units
Conditions
TH01
θJA
Thermal Resistance
Junction to Ambient
69.8
85.0
100.4
46.3
32.5
31.0
31.7
2.6
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
14-pin PDIP package
TH02
θJC
Thermal Resistance
Junction to Case
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
For derated power calculations
PD = PINTERNAL + PI/O
TH03
TH04
TH05
TJ
Junction Temperature
Power Dissipation
150
—
PD
W
PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD
(NOTE 1)
TH06
TH07
PI/O
I/O Power Dissipation
Derated Power
—
—
W
W
PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
PDER = (TJ - TA)/θJA
(NOTE 2, 3)
PDER
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
© 2007 Microchip Technology Inc.
DS41203D-page 151
MICROCHIP [ MICROCHIP ]
