PIC16C62X
Package Type: K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
E1
E
p
D
2
1
B
n
X
α
45°
L
R2
c
A
A1
R1
φ
β
L1
A2
Units
Dimension Limits
Pitch
INCHES*
NOM
0.050
18
MILLIMETERS
MIN
MAX
MIN
NOM
1.27
18
MAX
p
n
A
A1
A2
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Chamfer Distance
Shoulder Radius
Gull Wing Radius
Foot Length
0.093
0.099
0.058
0.008
0.456
0.296
0.407
0.020
0.005
0.005
0.016
4
0.104
2.36
1.22
2.50
1.47
0.19
11.58
7.51
10.33
0.50
0.13
0.13
0.41
4
2.64
1.73
0.28
11.73
7.59
10.64
0.74
0.25
0.25
0.53
8
0.048
0.004
0.450
0.292
0.394
0.010
0.005
0.005
0.011
0
0.068
0.011
0.462
0.299
0.419
0.029
0.010
0.010
0.021
8
0.10
11.43
7.42
10.01
0.25
0.13
0.13
0.28
0
‡
D
E
‡
E1
X
R1
R2
L
Foot Angle
φ
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*
L1
c
B
α
β
0.010
0.009
0.014
0
0.015
0.011
0.017
12
0.020
0.012
0.019
15
0.25
0.23
0.36
0
0.38
0.27
0.42
12
0.51
0.30
0.48
15
†
0
12
15
0
12
15
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 97
MICROCHIP [ MICROCHIP ]
