PIC16C62X
14.0 PACKAGING INFORMATION
Package Type: K04-010 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil
E
D
W2
2
1
n
W1
E1
A
A1
R
L
c
A2
B1
eB
p
B
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
INCHES*
NOM
0.300
18
MILLIMETERS
MIN
MAX
MIN
NOM
7.62
18
MAX
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
W1
W2
0.098
0.100
0.019
0.055
0.013
0.010
0.183
0.111
0.023
0.138
0.900
0.298
0.270
0.385
0.140
0.200
0.102
2.49
0.41
2.54
0.47
1.40
0.32
0.25
4.64
2.82
0.57
3.49
22.86
7.56
6.86
9.78
0.14
0.2
2.59
0.016
0.050
0.010
0.008
0.175
0.091
0.015
0.125
0.880
0.285
0.255
0.345
0.130
0.190
0.021
0.060
0.015
0.012
0.190
0.131
0.030
0.150
0.920
0.310
0.285
0.425
0.150
0.210
0.53
1.52
0.38
0.30
4.83
3.33
0.76
3.81
23.37
7.87
7.24
10.80
0.15
0.21
1.27
0.25
0.20
4.45
2.31
0.00
3.18
22.35
7.24
6.48
8.76
0.13
0.19
Package Width
Radius to Radius Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter.
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 95
MICROCHIP [ MICROCHIP ]
