PIC16C745/765
28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
E1
W
D
2
n
1
E
A2
A
L
c
B1
eB
A1
p
B
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
28
28
.100
.185
.160
.038
.600
.520
1.460
.138
.010
.058
.020
.660
.280
2.54
4.70
Top to Seating Plane
Ceramic Package Height
Standoff
A
.170
.200
.165
.060
.625
.526
1.490
.150
.012
.065
.023
.710
.290
4.32
5.08
A2
A1
.155
.015
.595
.514
1.430
.125
.008
.050
.016
.610
.270
3.94
0.38
4.06
4.19
1.52
0.95
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
E
E1
D
L
15.11
13.06
36.32
3.18
15.24
13.21
37.08
3.49
15.88
13.36
37.85
3.81
Tip to Seating Plane
Lead Thickness
c
0.20
0.25
0.30
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
B1
B
1.27
1.46
1.65
0.41
0.51
0.58
eB
W
15.49
6.86
16.76
7.11
18.03
7.37
*Controlling Parameter
JEDEC Equivalent: MO-103
Drawing No. C04-013
1999 Microchip Technology Inc.
Advanced Information
DS41124A-page 147
MICROCHIP [ MICROCHIP ]
