PIC16C745/765
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
β
B1
A1
p
eB
B
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
28
28
.100
.150
.130
2.54
3.81
3.30
Top to Seating Plane
A
.140
.160
3.56
4.06
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.125
.015
.300
.279
1.345
.125
.008
.040
.016
.320
5
.135
3.18
0.38
7.62
7.09
34.16
3.18
0.20
1.02
0.41
8.13
5
3.43
.313
.307
1.365
.130
.012
.053
.019
.350
10
.325
.335
1.385
.135
.015
.065
.022
.430
15
7.94
7.80
34.67
3.30
0.29
1.33
0.48
8.89
10
8.26
8.51
35.18
3.43
0.38
1.65
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
eB
α
β
5
10
15
5
10
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
1999 Microchip Technology Inc.
Advanced Information
DS41124A-page 145
MICROCHIP [ MICROCHIP ]
