PIC16C745/765
16.1
DC Characteristics:
PIC16C745/765 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0°C ≤ TA ≤
-40°C ≤ TA ≤
+70°C for commercial
+85°C for industrial
Param
Sym
No.
Characteristic
Min Typ† Max Units
Conditions
D001
VDD
VDR
Supply Voltage
4.35
5.25
V
V
See Figure 16-1
–
D002*
RAM Data Retention
Voltage (Note 1)
1.5
–
–
D003
VPOR
SVDD
VDD Start Voltage to ensure
internal
Power-on Reset signal
VSS
V
See section on Power-on Reset for details
–
–
D004*
D004A*
VDD Rise Rate to ensure inter-
nal Power-on Reset signal
0.05
TBD
V/mS PWRT enabled (PWRTE bit clear)
V/mS PWRT disabled (PWRTE bit set)
See section on Power-on Reset for details
–
–
–
–
D005
VBOR
IDD
Brown-out Reset
voltage trip point
3.65
4.35
V
Brown-out Reset is always active
–
D010
D013
Supply Current
(Note 2, 4)
TBD
TBD
TBD
TBD
TBD
TBD
mA FINT = 24 MHz, VDD = 4.35V
FINT = 24 MHz, VDD = 5.25V
D020
D021
D021B
IPD
Power-down Current
(Note 3, 4)
TBD
TBD
TBD
TBD
TBD
TBD
µA
µA
VDD = 4.35V
VDD = 5.25V
Module Differential
Current (Note 5, 6)
Watchdog Timer
Brown-out Reset
Capture Compare PWM
Analog
Not suspend mode
Suspend mode
Phase Lock Loop
D022*
D022A*
∆IWDT
∆IBOR
∆ICCP
∆IA/D
∆IUSB
∆IUSB
∆PLL
–
–
6.0
100
20
150
µA
µA
µA
µA
µA
µA
µA
WDTE bit set, VDD = 4.35V
BODEN bit set, VDD = 5.0V
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
1A
FOSC
HS oscillator operating freq.
H4 oscillator operating freg.
EC oscillator operating freq.
E4 oscillator operating freq.
24
6
24
6
—
—
—
—
24
6
24
6
MHz All temperatures
MHz All temperatures
MHz All temperatures
MHz All temperatures
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consump-
tion.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from characterization and is for
design guidance only. This is not tested.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD
or IPD measurement.
6: Module differential currents measured at FINT = 24 MHz.
1999 Microchip Technology Inc.
Advanced Information
DS41124A-page 125
MICROCHIP [ MICROCHIP ]
