PIC16C55X(A)
11.5
Package Marking Information
18-Lead PDIP
Example
XXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXX
PIC16C558A
-04I / P456
9523 CBA
AABBCDE
18-Lead SOIC (.300")
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
PIC16C558
-04I / S0218
AABBCDE
9518 CDK
18-Lead CERDIP Windowed
Example
XXXXXXXX
XXXXXXXX
AABBCDE
16C558
/JW
9501 CBA
20-Lead SSOP
Example
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
PIC16C558A
-04I / 218
9551 CBP
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
BB
C
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.
D
E
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS40143B-page 86
Preliminary
1997 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
