PIC16C55X(A)
11.0 PACKAGING INFORMATION
Ceramic CERDIP Dual In-Line Family
Symbol List for Ceramic CERDIP Dual In-Line Package Parameters
Description of Parameters
Symbol
α
Angular spacing between min. and max. lead positions measured at the gauge plane
Distance between seating plane to highest point of body (lid)
Distance between seating plane and base plane
A
A1
A2
A3
B
Distance from base plane to highest point of body (lid)
Base body thickness
Width of terminal leads
B1
C
Width of terminal lead shoulder which locate seating plane (standoff geometry optional)
Thickness of terminal leads
D
Largest overall package parameter of length
D1
E
Body width parameters not including leads
Largest overall package width parameter outside of lead
Body width parameter - end lead center to end lead center
Linear spacing of true minimum lead position center line to center line
Linear spacing between true lead position outside of lead to outside of lead
Linear spacing between center lines of body standoffs (terminal leads)
Distance from seating plane to end of lead
E1
eA
eB
e1
L
N
Total number of potentially usable lead positions
S
Distance from true position center line of Number 1 lead to the extremity of the body
Distance from other end lead edge positions to the extremity of the body
S1
Notes:
1. Controlling parameter: inches.
2. Parameter “e1” (“e”) is non-cumulative.
3. Seating plane (standoff) is defined by board hole size.
4. Parameter “B1” is nominal.
1997 Microchip Technology Inc.
Preliminary
DS40143B-page 79
MICROCHIP [ MICROCHIP ]
