PIC16F62X
17.1
DC CHARACTERISTICS:
PIC16F62X-04 (Commercial, Industrial, Extended)
PIC16F62X-20 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature –40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ TA ≤ +70°C for commercial and
–40°C ≤ TA ≤ +125°C for extended
Param Sym
No.
Characteristic
Min Typ† Max Units
Conditions
D001
D002
VDD
VDR
Supply Voltage
3.0
-
5.5
V
RAM Data Retention
Voltage (Note 1)
–
1.5*
–
V
Device in SLEEP mode
See section on power-on reset for details
D003
D004
D005
VPOR
SVDD
VBOD
IDD
VDD start voltage to
ensure Power-on Reset
–
Vss
–
–
–
V
VDD rise rate to ensure
Power-on Reset
0.05*
V/ms See section on power-on reset for details
Brown-out Detect Voltage
3.7
3.7
4.0
4.0
4.3
4.4
V
BODEN configuration bit is cleared
(Extended)
D010
D013
Supply Current (Note 2, 5)
–
–
0.7
mA FOSC = 4.0 MHZ, VDD = 3.0
–
–
–
4.0
–
–
7.0
6.0
2.0
mA FOSC = 20.0 MHz, VDD = 5.5
mA FOSC = 20.0 MHz, VDD = 4.5
mA FOSC = 10.0 MHz, VDD = 3.0
D020
IPD
Power Down Current (Note 3)
–
–
–
–
–
–
–
–
2.2
5.0
9.0
µA
µA
µA
µA
VDD = 3.0
VDD = 4.5
VDD = 5.5
VDD = 5.5 Extended
15.0
∆IWDT
∆IBOD
WDT Current (Note 4)
–
6.0
20
25
125
50
µA
µA
µA
µA
VDD=4.0V
(125°C)
BOD enabled, VDD = 5.0V
VDD = 4.0V
D023
1A
Brown-out Detect Current (Note 4)
∆ICOMP Comparator Current for each
Comparator (Note 4)
–
–
75
30
∆IVREF VREF Current (Note 4)
–
135
µA
VDD = 4.0V
FOSC
LP Oscillator Operating Frequency
INTRC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
0
–
0
0
–
–
–
–
200
4
4
KHz All temperatures
MHz All temperatures
MHz All temperatures
MHz All temperatures
20
*
These parameters are characterized but not tested.
†
Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
5: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2Rext (mA) with Rext in kΩ.
DS40300B-page 134
Preliminary
1999 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
