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PIC16F873A-I/SO 参数 Datasheet PDF下载

PIC16F873A-I/SO图片预览
型号: PIC16F873A-I/SO
PDF下载: 下载PDF文件 查看货源
内容描述: 40分之28引脚增强型闪存微控制器 [28/40-pin Enhanced FLASH Microcontrollers]
分类和应用: 闪存微控制器和处理器外围集成电路光电二极管PC时钟
文件页数/大小: 222 页 / 3815 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC16F87XA  
17.1 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial)  
PIC16LF873A/874A/876A/877A (Industrial) (Continued)  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
PIC16LF873A/874A/876A/877A (Industrial)  
PIC16F873A/874A/876A/877A (Industrial)  
Standard Operating Conditions (unless otherwise stated)  
Operating temperature -40°C TA +85°C for industrial  
Param Symbol  
No.  
Characteristic/  
Device  
Min  
Typ† Max Units  
Conditions  
IPD  
Power-down Current(3,5)  
D020  
16LF87XA  
7.5  
10.5  
0.9  
1.5  
0.9  
1.5  
85  
30  
42  
5
µA VDD = 3.0V, WDT enabled,  
-40°C to +85°C  
D020  
D021  
D021  
D021A  
D021A  
D023  
16F87XA  
16LF87XA  
16F87XA  
16LF87XA  
16F87XA  
µA VDD = 4.0V, WDT enabled,  
-40°C to +85°C  
µA VDD = 3.0V, WDT disabled,  
0°C to +70°C  
16  
5
µA VDD = 4.0V, WDT disabled,  
-40°C to +85°C  
µA VDD = 3.0V, WDT disabled,  
-40°C to +85°C  
19  
200  
µA VDD = 4.0V, WDT disabled,  
-40°C to +85°C  
IBOR  
Brown-out  
µA BOR enabled, VDD = 5.0V  
Reset Current(6)  
Legend: Rows with standard voltage device data only are shaded for improved readability.  
Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance  
only, and are not tested.  
Note 1: This is the limit to which VDD can be lowered without losing RAM data.  
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O  
pin loading, switching rate, oscillator type, internal code execution pattern and temperature also have an  
impact on the current consumption.  
The test conditions for all IDD measurements in active operation mode are:  
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;  
MCLR = VDD; WDT enabled/disabled as specified.  
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is  
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.  
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-  
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.  
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from charac-  
terization and is for design guidance only. This is not tested.  
6: The current is the additional current consumed when this peripheral is enabled. This current should be  
added to the base IDD or IPD measurement.  
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.  
2001 Microchip Technology Inc.  
Advance Information  
DS39582A-page 175  
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