MCP2021/2
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
c
φ
A2
A
L
A1
L1
β
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
Overall Height
Molded Package Thickness
Standoff §
A
–
1.25
0.10
–
–
–
1.75
–
0.25
A2
A1
E
Overall Width
6.00 BSC
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
E1
D
h
3.90 BSC
4.90 BSC
0.25
0.40
–
–
0.50
1.27
L
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
L1
φ
c
b
α
1.04 REF
0°
0.17
0.31
5°
–
–
–
–
–
8°
0.25
0.51
15°
β
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS22018E-page 34
© 2009 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
