MCP2021/2
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
INCHES
Dimension Limits
MIN
NOM
8
.100 BSC
–
.130
–
.310
.250
.365
.130
.010
.060
.018
–
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
N
e
A
A2
A1
E
E1
D
L
c
b1
b
eB
–
.210
.195
–
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
.325
.280
.400
.150
.015
.070
.022
.430
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
© 2009 Microchip Technology Inc.
DS22018E-page 33
MICROCHIP [ MICROCHIP ]
