ENC28J60
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
E
E1
p
D
B
2
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
28
MAX
MIN
NOM
28
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.093
.099
.091
.008
.407
.295
.704
.020
.033
4
.104
2.36
2.50
2.31
0.20
10.34
7.49
17.87
0.50
0.84
4
2.64
Molded Package Thickness
Standoff
A2
A1
E
E1
D
.088
.004
.394
.288
.695
.010
.016
0
.094
.012
.420
.299
.712
.029
.050
8
2.24
0.10
10.01
7.32
17.65
0.25
0.41
0
2.39
0.30
10.67
7.59
18.08
0.74
1.27
8
§
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
h
L
φ
c
Foot Angle Top
Lead Thickness
Lead Width
.009
.014
0
.011
.017
12
.013
.020
15
0.23
0.36
0
0.28
0.42
12
0.33
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
© 2006 Microchip Technology Inc.
Preliminary
DS39662B-page 85
MICROCHIP [ MICROCHIP ]
