ENC28J60
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
E
E2
EXPOSED
METAL
PAD
(NOTE 2)
e
b
D
D2
2
1
K
n
OPTIONAL
INDEX
AREA
ALTERNATE
INDEX
INDICATORS
SEE DETAIL
L
TOP VIEW
BOTTOM VIEW
(NOTE 1)
A1
A
DETAIL
ALTERNATE
PAD OUTLINE
Units
INCHES
NOM
MILLIMETERS
NOM
28
*
Dimension Limits
MIN
MAX
MIN
MAX
n
e
Number of Pins
Pitch
28
.026 BSC
0.65 BSC
0.90
Overall Height
Standoff
A
A1
A3
E
.031
.035
.001
.039
0.80
1.00
.000
.002
0.00
0.02
0.05
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
.008 REF
0.20 REF
6.00
.232
.153
.232
.153
.009
.018
.008
.236
.167
.236
.167
.011
.022
–
.240
.169
.240
.169
.013
.024
–
5.90
3.89
5.90
3.89
0.23
0.45
0.20
6.10
4.29
6.10
4.29
0.33
0.65
–
E2
D
4.24
6.00
D2
β
4.24
0.28
L
0.55
Contact-to-Exposed Pad
§
K
–
*
Controlling Parameter
§
Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: MO-220
Drawing No. C04-105
Revised 09-12-05
© 2006 Microchip Technology Inc.
Preliminary
DS39662B-page 87
MICROCHIP [ MICROCHIP ]
