11.2 8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
A
b
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
e
A2
D
SYMBOL
MIN
-
NOM
-
MAX
1.20
0.15
1.05
3.10
NOTE
2, 5
A
Side View
A1
A2
D
0.05
0.80
2.90
-
Notes: 1. This drawing is for general information only.
1.00
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
3.00
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
E
6.40 BSC
4.40
E1
b
4.30
0.19
4.50
0.30
3, 5
4
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
0.25
e
0.65 BSC
0.60
L
0.45
0.09
0.75
0.20
L1
C
1.00 REF
-
2/27/14
TITLE
GPC
TNR
DRAWING NO.
REV.
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
8X
E
Package Drawing Contact:
packagedrawings@atmel.com
AT93C46D Automotive [DATASHEET]
Atmel-8674C-SEEPROM-AT93C46D-Automotive-Datasheet_102014
15
MICROCHIP [ MICROCHIP ]
